Endicott Innovation 2.0


A legacy process orphaned by IBM-Endicott 20 years ago could make Binghamton University a ground zero for the rapidly developing field of flexible circuits.”

So begins Jeff Platsky’s article from the April 6 announcement by Governor Cuomo to invest $20 million in Binghamton University’s research in flexible technology. The location for this investment couldn’t be better at Huron, buildings that were once all-encompassed by IBM.  

We’ve all driven past the mostly vacant buildings that are a reminder of a comfortable economic past. This is a past we honor, but are more than ready to let go of. What better way to signal a new era in innovation than to place this research in Endicott where it began more than a decade ago. This investment, part of the Southern Tier’s Upstate Revitalization Plan will establish Endicott and the Huron campus, as a “shared hub for advanced manufacturing technology,” which will provide incentives for companies to locate in Endicott.

The planned Flex-Tech Alliance will enable BU research staff to stand on the cutting edge of flexible circuitry, which is used in virtually every electronic device. Partnerships have already been forged as a result of this technology, between BU and Corning, Inc., i3 Electronics, and Lockheed Martin, to name a few. This builds on BU’s existing presence at Huron, through its (CAMM) program.

What’s also important to make note of, is that this investment demonstrates BU’s continued investment in the community. Just drive down Hawley Street in Binghamton, Corliss Avenue in Johnson City, and you’ll see the transformations already occurring. When knowledge, vision, and resources collide, great things can happen.

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